Archive for April, 2007

Congratulations to Lau Tak Kin, Lau Tak Shing of 2D and Wong Cheuk Hang of 3D. They have won the First Class Award with their invention ‘Anti-Bump Lock’ (防撞鎖)in the Hong Kong Youth Science and Technology Invention Competition 2006-2007 (香港青少年科技創新大賽).

(more…)

Continue
  • RSS
  • Facebook