Congratulations to Lau Tak Kin and Lau Tak Shing of 2D (Anti-Bump Lock). They have entered the final round of the Hong Kong Student Science Project Competition and won the “The Best Booth Presentation” Award. An exhibition booth was set up at the Hong Kong Convention and Exhibition Centre on May 19, 2007. The Final Judging will be held at the Hong Kong Convention and Exhibition Centre on June 2, 2007. All are welcome.